Towards a high power RF system-in-package technology

Sammanfattning

This thesis investigates a System-in-Package (SiP) solution for future Radio Frequency(RF) applications. The work focuses on the development of a design andevaluation methodology for future RF-SiP implementation using electromagneticsimulation. The study includes the investigation of different material propertiesand their impact on important SiP building blocks and overall RF performance. Aparticular focus is placed on the evaluation of a novel silicon carbide (SiC) interposertechnology currently under development. Passive RF components, includinginductors and filters, were designed and implemented on the interposer in order toevaluate its suitability for RF applications. MultiTech simulations in ADS RFProwere used as a design tool and method for evaluating RF-SiP structures, materialproperties, and flip-chip integrated components. In addition, an evaluation boardwith a calibration kit for future RF-SiP measurements was designed as part of thework. The results provide insights into the design and development of future RF-SiPsystems. The findings indicate that ADS and MultiTech provide support for RFSiPdevelopment and evaluation, although several limitations were identified duringthe design and simulation process. Furthermore, the investigated interposer andthe investigated passive components demonstrates promising characteristics for RFapplications, while flip-chip integration affects needs to be accounted for. Overall,the findings contribute to a broader understanding of RF-SiP design process andprovide insights to the development of future broadband and high-power RF-SiPsolutions.