A comparative investigation of Finite element models to evaluate paperboard packaging performance

Sammanfattning

Paper and paperboard offer several advantages as packaging materials, but tofully realize their potential, modern computational methods are used to aidinformed design solutions and process development. These models, however,are often computationally expensive and require large computer clusters toachieve high-fidelity results. Therefore, this thesis aims to analyze the mainfailure mechanisms of paperboard packaging using efficient, commerciallyavailable finite element analysis models with varying material properties. Most models presented in this work use varying material formulations andsingle-layer shell elements to reduce computational cost. A cohesive zonemodel with two shell layers was also investigated to introduce delaminationbehavior. At least one model for each governing failure mechanism (tearingand delamination) predicted the corresponding mechanical behavior withreasonable accuracy. However, some aspects will require more sophisticatedmodels to accurately model damage propagation. Overall, the findingsdemonstrate that simplified finite element models can reduce computationalcost, thereby enabling more accessible investigations of material propertiesand providing tools to substantiate the mechanical performance of packagingsolutions